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The wire is manually fed by a precision linear drive feedthrough, and must be
fed periodically as determined by source evaporation rates. The e-Vap® 100 source evaporates high temperature
refractory metals including Tantalum, Molybdenum and Tungsten and most other materials
manufactured in wire form. High temperature materials are not readily evaporated using Knudsen or Effusion cells,
making the e–Vap® 100, because of its miniature size, an excellent Physical
Vapor Deposition (PVD) evaporation source. The evaporation rate table
for EV-100 depicts calculated deposition rates for various pure
materials. The e-Vap® 100 source is constructed with refractory metals for rapid
equilibrium with minimal outgassing, to withstand elevated temperatures
without the need for water cooling and to reduce the possibility of contamination in sensitive
UHV applications. The source has an outgas mode to allow vacuum conditioning of the evaporation
head. This degas feature allows heating of the e-Vap® 100 head to drive off
any adsorbed contaminant. The source is mounted on a 2-3/4" Del-Seal™ CF flange. Power connections are made
via four SHV coaxial connectors clearly labeled for filament positive, filament negative,
anode and screen inputs. Maintenance on the evaporation head is made simple with easy replacement of all key
components.
Source Assembly
The e-Vap® 100 power supply incorporates all switching technology for the high-voltage and
filament sections. This translates to a smaller and lighter package, greatly improved arc-suppression
and better emission current control. Arcs are suppressed in the order of
microseconds rather than the millisecond response in other 50/60Hz systems.
This, combined with lower levels of stored energy, prevent the molten tip of the evaporant rod from
being “blown away” during an arc, a common occurrence with older systems.
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